激光切割是將(jiang)從激(ji)光(guang)(guang)器發(fa)射(she)出(chu)的激(ji)光(guang)(guang),經光(guang)(guang)路系統,聚焦(jiao)成高(gao)功(gong)率(lv)密(mi)度的激(ji)光(guang)(guang)束。激(ji)光(guang)(guang)束照射(she)到(dao)工(gong)件(jian)表(biao)面,使(shi)工(gong)件(jian)達到(dao)熔點(dian)或沸點(dian),同時與光(guang)(guang)束同軸的高(gao)壓氣體將(jiang)熔化(hua)或氣化(hua)金(jin)屬吹走(zou)。隨(sui)著光(guang)(guang)束與工(gong)件(jian)相(xiang)對位置的移動(dong),終(zhong)使(shi)材料形成切縫,從而達到(dao)切割的目的。
激(ji)(ji)光(guang)(guang)(guang)切(qie)(qie)(qie)割(ge)(ge)加(jia)(jia)工(gong)(gong)是用(yong)不(bu)可見的(de)光(guang)(guang)(guang)束代(dai)替了傳(chuan)統的(de)機械刀(dao),具(ju)有,切(qie)(qie)(qie)割(ge)(ge),不(bu)局限于切(qie)(qie)(qie)割(ge)(ge)圖案限制,自動排(pai)版(ban)節省(sheng)材料,切(qie)(qie)(qie)口平(ping)滑(hua),加(jia)(jia)工(gong)(gong)成(cheng)本低等特點(dian),將逐(zhu)漸(jian)改進或(huo)取代(dai)于傳(chuan)統的(de)金(jin)屬切(qie)(qie)(qie)割(ge)(ge)工(gong)(gong)藝設(she)備。激(ji)(ji)光(guang)(guang)(guang)刀(dao)頭的(de)機械部(bu)分與工(gong)(gong)件(jian)無接觸,在工(gong)(gong)作中(zhong)不(bu)會對(dui)工(gong)(gong)件(jian)表面造(zao)成(cheng)劃傷;激(ji)(ji)光(guang)(guang)(guang)切(qie)(qie)(qie)割(ge)(ge),切(qie)(qie)(qie)口光(guang)(guang)(guang)滑(hua)平(ping)整(zheng),一般無需后續加(jia)(jia)工(gong)(gong);切(qie)(qie)(qie)割(ge)(ge)熱影響區小,板材變(bian)形(xing)小,切(qie)(qie)(qie)縫(feng)窄(0.1mm~0.3mm);切(qie)(qie)(qie)口沒械應力,無剪切(qie)(qie)(qie)毛刺;加(jia)(jia)工(gong)(gong),重復性(xing)好,不(bu)損傷材料表面;數控編程(cheng),可加(jia)(jia)工(gong)(gong)任意的(de)平(ping)面圖,可以對(dui)幅面很(hen)大的(de)整(zheng)板切(qie)(qie)(qie)割(ge)(ge),無需開模具(ju),經(jing)濟省(sheng)時(shi)。
激(ji)光(guang)(guang)(guang)切割是應用激(ji)光(guang)(guang)(guang)聚(ju)焦(jiao)后產生的(de)(de)高(gao)功率(lv)密度能量(liang)來實現(xian)的(de)(de)。在(zai)計(ji)(ji)算機(ji)的(de)(de)控制下(xia),通(tong)過(guo)脈(mo)(mo)(mo)沖(chong)(chong)使激(ji)光(guang)(guang)(guang)器放電,從而(er)輸出受控的(de)(de)重復(fu)高(gao)頻(pin)率(lv)的(de)(de)脈(mo)(mo)(mo)沖(chong)(chong)激(ji)光(guang)(guang)(guang),形(xing)(xing)成頻(pin)率(lv),脈(mo)(mo)(mo)寬的(de)(de)光(guang)(guang)(guang)束,該脈(mo)(mo)(mo)沖(chong)(chong)激(ji)光(guang)(guang)(guang)束經過(guo)光(guang)(guang)(guang)路(lu)傳導(dao)及(ji)反射(she)并通(tong)過(guo)聚(ju)焦(jiao)透鏡組聚(ju)焦(jiao)在(zai)加(jia)工(gong)(gong)物(wu)體的(de)(de)表面上(shang),形(xing)(xing)成一個(ge)個(ge)細微的(de)(de)、量(liang)密度光(guang)(guang)(guang)斑(ban),焦(jiao)斑(ban)位(wei)于待加(jia)工(gong)(gong)面附近,以(yi)瞬(shun)間高(gao)溫熔(rong)化或氣化被加(jia)工(gong)(gong)材料。每一個(ge)量(liang)的(de)(de)激(ji)光(guang)(guang)(guang)脈(mo)(mo)(mo)沖(chong)(chong)瞬(shun)間就把(ba)物(wu)體表面濺射(she)出一個(ge)細小的(de)(de)孔,在(zai)計(ji)(ji)算機(ji)控制下(xia),激(ji)光(guang)(guang)(guang)加(jia)工(gong)(gong)頭與被加(jia)工(gong)(gong)材料按預先繪(hui)好的(de)(de)圖(tu)形(xing)(xing)進行連續相對(dui)運動打點(dian),這樣就會把(ba)物(wu)體加(jia)工(gong)(gong)成想要的(de)(de)形(xing)(xing)狀。
激光切割技術廣泛應(ying)用于金屬(shu)和(he)非金屬(shu)材料(liao)的加工(gong)中(zhong),可(ke)減少加工(gong)時間,降低(di)加工(gong)成本,提高工(gong)件質量。